Large companies already build 2.5D chiplet systems and are eyeing 3D-IC implementations. When will the [chiplet paradigm](/content/technologies/chiplets/index.html) move into the mainstream? Much depends on the emergence of a robust supporting ecosystem. [Brian Bailey](https://semiengineering.com/author/brian/) interviewed Bob Patti and other experts for his excellent article in Semiconductor Engineering: **[“3D-IC Ecosystem Starts To Take Form”](https://semiengineering.com/3d-ic-ecosystem-starts-to-take-form/)**

- [2.5D](/content/tag/2-5d/index.html)
- [3D IC](/content/tag/3d-ic/index.html)
- [chiplets](/content/tag/chiplets/index.html)