Overview

Batavia Headquarters

1201 N. Raddant Road, Batavia, IL 60510

Known as the “City of Energy,” Batavia gained prominence in the 1800s by manufacturing windmills to power farms across the prairies. Today Batavia boasts Fermilab, a government-sponsored particle physics and accelerator laboratory.

Our headquarters in Batavia is home to our top leadership and our design engineering team. Working under the leadership of 3D pioneer Bob Patti, this versatile crew extends the functionality of advanced ICs in exciting new directions.

Services Offered

Project management
Chip, chiplet, and interposer designs
Circuit redesign for 3D integration
System-level architecture, definition, specification
Development of algorithms, drivers, firmware
Hardware front-end design
Physical back-end design
AI systems, embedded software, OS customization
Schematics, synthesis, verification, emulation
Mask set generation
Burn-in boards, load boards, probe cards, QA test programs

[MORE ABOUT OUR DESIGN SERVICES](/content/services/advanced-design-services/ "MORE ABOUT OUR DESIGN SERVICES"/index.html)

Morrisville Facility

800 Perimeter Park Drive, Morrisville, NC 27560

Morrisville is in the heart of North Carolina’s Research Triangle, a metropolitan area anchored by Raleigh, Durham, Chapel Hill, and three major research universities.

Our R&D and prototyping fab is ISO 9001:2015 certified for its quality management system as a semiconductor process service provider. The facility’s toolset is ideal for process development and rapid prototyping of 3D-ICs and interposer assemblies. It currently supports wafers up to 200mm including very small specialty wafers.

Facility Capabilities

Diverse, skilled team of engineers and technicians
25,000 sq. ft. facility
7,000 sq. ft. cleanroom (Class 100)
In-house 2.5D/3D technology development
In-house 2.5D/3D IC prototyping
Wafer-to-wafer, die-to-wafer, and chiplet-to-interposer bonding
Hybrid bonding (DBI, DBI Ultra, ZiBond)
Micro-Transfer Printing (MTP)
BEOL, both aluminum and copper
Copper interconnect
Use of exotic materials
Photolithography
Etching
Thin film deposition
Surface preparation
Metalization
Pick-and-place
Thinning, CMP, backside processes on thinned surfaces
Wafer reconstitution
TSV insertion
HDI quilt packaging

[MORE ABOUT OUR FAB SERVICES](/content/services/fab-services/ "MORE ABOUT OUR FAB SERVICES"/index.html)

Odon Package Assembly Facility

14590 Schonberger Drive, Odon, IN 47562

Odon is part of Indiana’s growing semiconductor ecosystem, situated near the US Navy’s Crane facility, the WestGate complex, and several new high-tech ventures.

Purpose-built for the future of low- to mid-volume specialty advanced device production, our Odon package assembly facility came online in November 2023. It supports our Foundry 2.0 ™ manufacturing model and features two fully-equipped semiconductor cleanrooms.

Facility Features

Rapidly growing staff and capabilities
30,000 sq. ft. facility
5,000 sq. ft. cleanroom (Class 100)
Interposers
- Silicon, glass, fused silica
- Optical and electrical interconnect
- Assembly to substrate
Photonic assembly
Solder bumping
Flip chip assembly
Thermocompression bonding (TCB)
Co-packaged optics
Full prototyping and low-volume assembly on site

[MORE ABOUT OUR FAB SERVICES](/content/services/fab-services/ "MORE ABOUT OUR FAB SERVICES"/index.html)

Contact Information

Phone: +1 331-701-7070

Fax: +1 331-701-7055