# Chiplet Architecture is the Future

The shift from monolithic system-on-chip (SoC) designs to chiplet-based architectures is not simply architectural; it raises the bar for advanced packaging, where hybrid bonding has emerged as a cornerstone technology.

## Presenting Hardware-Level Security for Detecting Counterfeits (media alert)

Woychik and Asadi’s team from U. of Florida will detail a hardware-level security framework for detecting counterfeit parts and materials.

## Presenting Hybrid Bonding Reliability at 2026 ECTC in Orlando (media alert)

Woychik and Asadi’s team from U. of Florida will detail a new predictive reliability model for hybrid bonding.

## Hybrid Bonding Everywhere

The real challenge with hybrid bonding is maintaining a robust and repeatable production cycle.

## Bigger is Better?

Charles Woychik explains why bigger TSVs can be a better solution.

## The Unfinished Revolution

Advanced Packaging and Heterogeneous Integration: Amazing breakthroughs lie ahead. It won’t be easy — but it will be awesome.

## Hybrid Bonding Symposium 2026

Hybrid Bonding empowers the new chiplet paradigm and Foundry 2.0.

## Evolution of Electronics Packaging

Charles Woychik at IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), October 2025.

## Global View vs US Focus on OSATs

Charles Woychik at Counterfeit Parts & Materials symposium, June 2025.

### Key Terms
- **2.5D:** An advanced packaging technology that interconnects components on an interposer within a single packaged device.
- **Chiplet:** An unpackaged IC that contains a well-defined subset of functionality, designed to be integrated with other components into a finished device.
- **Foundry 2.0:** A manufacturing model that takes building blocks from traditional semiconductor manufacturers and uses advanced packaging and additive manufacturing to create highly customized devices.
- **Heterogeneous Integration:** The combining of different types of integrated circuitry in a single device; differences may be in process, node, substrate, source, or function.
- **Through Silicon Via (TSV):** A vertical electrical connection that pierces the substrate.
- **W2W:** Wafer-to-Wafer (also wafer-on-wafer) stacking: bonding and integrating whole processed wafers atop one another before dicing the stack.