Hybrid Bonding Symposium 2026
Hybrid Bonding empowers the new chiplet paradigm and Foundry 2.0
Date: January 29, 2026
Evolution of Electronics Packaging
Charles Woychik at IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), October 2025
Date: October 29, 2025
The Future of Electronics Packaging is Chiplet Architecture
Chuck Woychik at SMTA International Conference & Exposition 2025
Date: September 30, 2025
Global View vs US Focus on OSATs
Charles Woychik at Counterfeit Parts & Materials symposium, June 2025
Date: June 25, 2025
Four Dimensions of Heterogeneous Integration
White Paper: Heterogeneous Integration is the "secret power" of Advanced Packaging
Date: June 13, 2025
Building Advanced Devices with DBI®
White Paper: NHanced employs DBI® (Adeia's Direct Bond Interface) for hybrid bonding.
Date: April 15, 2025
Onshoring Advanced Packaging
Charles Woychik at IEEE Hybrid Bonding Symposium, January 2025
Date: February 12, 2025
Hybrid Bonding: a Key Enabling Technology
Charles Woychik at IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), November 2024
Date: November 20, 2024
Next Generation Silicon Interposers
Chuck Woychik at SMTA International Conference & Exposition 2024
Date: October 22, 2024
NHanced Capabilities
Robert Patti presenting in-house for new employees
Date: August 1, 2024
Hybrid Bonding: Tools & Techniques
Robert Patti at CHICO Workshop (Chiplet-based Heterogeneous Integration & CO-design), San Francisco, CA
Date: June 23, 2024
The Path to Heterogeneous Integration
Charles Woychik at Florida Semiconductor Week, Gainesville, FL
Date: February 7, 2024
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