# Hybrid Bonding Symposium 2026

Hybrid Bonding empowers the new chiplet paradigm and Foundry 2.0

**Date:** January 29, 2026

## Evolution of Electronics Packaging

Charles Woychik at IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), October 2025

**Date:** October 29, 2025

## The Future of Electronics Packaging is Chiplet Architecture

Chuck Woychik at SMTA International Conference & Exposition 2025

**Date:** September 30, 2025

## Global View vs US Focus on OSATs

Charles Woychik at Counterfeit Parts & Materials symposium, June 2025

**Date:** June 25, 2025

## Four Dimensions of Heterogeneous Integration

White Paper: Heterogeneous Integration is the "secret power" of Advanced Packaging

**Date:** June 13, 2025

## Building Advanced Devices with DBI®

White Paper: NHanced employs DBI® (Adeia's Direct Bond Interface) for hybrid bonding.

**Date:** April 15, 2025

## Onshoring Advanced Packaging

Charles Woychik at IEEE Hybrid Bonding Symposium, January 2025

**Date:** February 12, 2025

## Hybrid Bonding: a Key Enabling Technology

Charles Woychik at IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE), November 2024

**Date:** November 20, 2024

## Next Generation Silicon Interposers

Chuck Woychik at SMTA International Conference & Exposition 2024

**Date:** October 22, 2024

## NHanced Capabilities

Robert Patti presenting in-house for new employees

**Date:** August 1, 2024

## Hybrid Bonding: Tools & Techniques

Robert Patti at CHICO Workshop (Chiplet-based Heterogeneous Integration & CO-design), San Francisco, CA

**Date:** June 23, 2024

## The Path to Heterogeneous Integration

Charles Woychik at Florida Semiconductor Week, Gainesville, FL

**Date:** February 7, 2024

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