Silicon thinning
- Grinding
- CMP
- Dry etch
- Wet etch, including HNA stop on epi
Bonding methods:
- Face-to-face, back-to-back, face-to-back
- Wafer-to-wafer (More than three active device wafers per stack)
- Die-to-wafer
- Die-to-die
- Component/chiplet to interposer
Bonding technologies:
- Low temperature bonding
- Covalent oxide bonding (ZiBond®)
- Hybrid Bonding: DBI® (Direct Bond Integration) using copper or nickel
- Thermocompression bonding (TCB)
- Temporary bonding/debonding
Interposers with TSV
Custom design & build
Thick layer copper damascene
Silicon, fused silica, borosilicate glass, and organic substrates
In development: post-fab formable metal with ultra-low CTE
Stitched fields (up to full wafer scale)
Chiplet integration
Front side and back side component mount