Customers bring us their ideas for advanced devices and specialized sensors. We carry these ideas from prototype to production, serving as a complete supply chain partner.
We collaborate, customize, and control the process — from multi-die/ chiplet design to sourcing, advanced packaging, and package assembly.
We focus on serving the needs of smaller market segments by performing cost-effective high-mix manufacturing at low and medium volumes.
Whether the project is industrial, medical, military, or scientific, we deliver system-level solutions for specialized and unique devices and sensors.
Many of today’s leading-edge products would benefit by 3D or 2.5D architecture using advanced packaging. From full-fledged 3DICs to smart interposers, from chiplets to photonics to microfluidics, we offer a host of exceptional technologies.
Our deep experience in hybrid bonding and 2.5D and 3D enablement empowers our customers to enhance their products’ performance.
Turning revolutionary ideas into unique devices takes a talented, creative team:
- Design engineers who translate brainstorms into brilliant circuitry
- Skilled technical experts for layout, P&R, meticulous simulation, and deep verification
- Hardcore logic gurus to craft embedded software
- Process wizards who transform the design into exquisite, flawless silicon
We are that team.
First we pioneered 3DICs, then we developed proficiency in hybrid bonding, 2.5D, interposers, chiplets, additive semiconductor manufacturing, and more.
Now our U.S.-based facilities provide end-to-end support, from design through packaging and test.
Together, we can create the future.
Chiplet Architecture is the Future
The shift from monolithic system-on-chip (SoC) designs to chiplet-based architectures is not simply architectural; it raises the bar for advanced packaging, where hybrid bonding has emerged as a cornerstone technology.
Hybrid Bonding Everywhere
The real challenge with hybrid bonding is maintaining a robust and repeatable production cycle.
Hybrid Bonding Symposium 2026
Hybrid Bonding empowers the new chiplet paradigm and Foundry 2.0.