The “secret power” of Advanced Packaging:
combining best-in-class components despite different processes, nodes, materials, and sources
Advanced Packaging – 2.5D and 3D – can integrate dies and elements that are:
- Manufactured with different process recipes
- Built at different technology nodes
- Made of different materials
- Sourced from different vendors
With Advanced Packaging, design engineers can craft extraordinary devices by incorporating best-in-class components, regardless of differences.
Bonding disparate substances is tricky. Currently, only a small set of materials can be reliably integrated.
NHanced is the only commercial provider offering hybrid bonding of dissimilar materials.
The NHanced process development team works with a wide range of unconventional substrates, continually improving and refining their methods and practices. They are determined to broaden the range of stackable, bondable materials. Today’s “maybe we can do it” will become tomorrow’s grand success.
Sourcing dies from more than one manufacturer is complicated. Integration requires a deep knowledge of each die, possibly including proprietary information that manufacturers are loath to divulge. Someday a robust chiplet ecosystem will solve this problem. Until then, multi-vendor devices will be rare.
That’s where the Foundry 2.0 model really shines. Because NHanced does not build transistors, it does not compete with die manufacturers.
“We are the Switzerland of semiconductors.” – Bob Patti
Solid, trusted relationships with many companies enable NHanced to handle projects that other providers would find very difficult to negotiate.
NHanced Semiconductors:
delivering heterogeneous solutions that other providers can’t touch
Four Dimensions of Heterogeneous Integration